メーカー | 部品番号 | データシート | 部品情報 |
TDK Electronics
|
CEU4J2X7R2A152K125AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
Stanson Technology
|
ST18N10D |
619Kb/6P |
TO-252 Package design |
ST25N10 |
866Kb/6P |
TO-252 package design |
KODENSHI_AUK CORP.
|
PIC-A1814 |
1Mb/3P |
Compact and lightweight design |
TDK Electronics
|
CEU3E2X7R1H682M080AE |
139Kb/1P |
Automotive Grade ( Serial Design ) |
CEU4J2X7R1H104M125AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
CEU4J2X7R2A103M125AE |
138Kb/1P |
Automotive Grade ( Serial Design ) |
CEU4J2X7R2A472K125AE |
139Kb/1P |
Automotive Grade ( Serial Design ) |
Schurter Inc.
|
DLF |
257Kb/3P |
Linear Choke, flat design 04.01.2022 |
HiSilicon(Shanghai) Tec...
|
HI3521 |
1Mb/56P |
Hi3521/Hi3520A hardware design 2012-08-30 |
Seme LAB
|
BUL65A |
24Kb/2P |
ADVANCED DISTRIBUTED BASE DESIGN |
Cypress Semiconductor
|
CY3620 |
33Kb/3P |
Design Kit for CPLDs |
Cirrus Logic
|
CRD5376 |
3Mb/68P |
Multichannel Seismic Reference Design |
Texas Instruments
|
LM3407 |
427Kb/13P |
Evaluation Board Reference Design |
Seoul Semiconductor
|
STW7C2SA |
1Mb/31P |
Thermally Enhanced Package Design |
STW8B12C |
894Kb/31P |
Thermally Enhanced Package Design |
STW9B12C |
685Kb/23P |
Thermally Enhanced Package Design |
M/A-COM Technology Solu...
|
AG312 |
488Kb/18P |
Design with PIN Diodes |
United Chemi-Con, Inc.
|
EKLG401E |
403Kb/2P |
Overvoltage resistant design, 105? |
Keysight Technologies
|
W2360EP |
4Mb/9P |
Advanced Design System (ADS) |