BUILT-IN Datasheet(PDF) - SDA9206 - Siemens Semiconductor Group

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BUILT-IN データシート, PDF

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検索されたキーワード : 'BUILT-IN' - 結果は: 133 (1/7) Pages

メーカー	部品番号	データシート	部品情報
Siemens Semiconductor G...	SDA9206	256Kb/54P	ADC with Built in Antialiasing filter and Clock generation UnitS
	PD1165	412Kb/8P	1.16 SQUARE 8X8 DOT MATRIX PROGRAMMABLE DISPLAY MODULE WITH ON BOARD DRIVERS, BUILT-IN RAM AND SOFTWARE CONTROLLABLE FEATURES
	MPD2545	438Kb/10P	25 4-character, 5x7 dot matrix, X-Y stackable, HI-REL/Military Alphanumeric Programmable Display with Built-In CMOS Control Functions
	SDA9088	487Kb/28P	Picture-in-Picture Processor
	STL39002Z	58Kb/3P	IRED in TO-Package
	SFH420	48Kb/5P	GaAs-IR-Lumineszenzdiode in SMT-Gehause GaAs Infrared Emitter in SMT Package
	SFH421	53Kb/5P	GaAlAs-IR-Lumineszenzdiode in SMT-Gehause GaAlAs Infrared Emitter in SMT Package
	SDA9388X	74Kb/2P	Single-Chip Picture in Picture IC
	SRD00111Z	119Kb/5P	Silicon PIN Photodiode in TO-Package
	STH51002Z	43Kb/3P	1300nm Laser in Coaxial TO-Package
	SDA9086-3	174Kb/9P	Horizontal PLL for Picture-in-Picture
	STH81002Z	43Kb/3P	1550nm Laser in Coaxial TO-Package
	KOM2125	241Kb/4P	NEU: 2fach-Silizium-PIN-Fotodiode in SMT NEW: 2-Chip Silicon PIN Photodiode in SMT
	STL51007X	80Kb/4P	1300 nm Laser in Receptacle Package, Low Power
	SDA9188-3X	462Kb/31P	Picture-in-Picture Processor with On-Chip PLL
	STL81007X	550Kb/4P	1550 nm Laser in Receptacle Package, Low Power
	STM51004X	128Kb/4P	1300 nm Laser in Receptacle Package, Medium Power
	SRD00231Z	66Kb/3P	Ternary PIN Photodiode in TO-Package, Central Pin
	BAV99S	42Kb/4P	Silicon Switching Diode Array (For high-speed switching applications Connected in series Internal galvanic isolated Diodes in one package)
	KT100	34Kb/2P	Silicon Spreading Resistance Temperature Sensor in Leaded Plastic Package

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BUILT-IN とは

電子コンポーネントでは、組み込みは通常、デバイスまたは機器に埋め込まれていることを意味します。

たとえば、スマートフォンの場合、カメラ、センサー、スピーカー、マイクなど、さまざまな組み込みコンポーネントがあります。

内蔵コンポーネントは、デバイスのサイズと機能に応じてさまざまな方法で構成されています。

ほとんどのデバイスでは、組み込みのコンポーネントが事前に設計されており、デバイスの全体的な機能とパフォーマンスを向上させるために使用されます。

組み込みのコンポーネントは他の部品に接続する必要はないため、部品間の接続によるエラーまたは信号減衰を減らすことができます。

さらに、組み込みのコンポーネントは機器の外側で保護されており、耐久性と信頼性が向上します。

組み込みコンポーネントは、利便性と効率を高めることもできます。

たとえば、スマートフォンの場合、内蔵カメラを使用して写真を撮ることができ、内蔵センサーを使用してデバイスの向きを検出できます。

これらの組み込みコンポーネントにより、さまざまな機能を便利に使用できます。

*この情報はあくまでも一般的な情報であり、上記の情報によって生じたいかなる損失や損害についても責任を負うものではありません。

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